![]() ![]() At its introduction, this innovative platform was awarded with the prestigious Swiss Technology Award.įINEPLACER® femto 2 Automated sub-micron Die Bonder It is the most effortless system to run, assist and control production resulting in a quantum leap in throughput and yield at the lowest cost of ownership. The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm 3 sigma. ![]() For evaluation panel size of 305 mm x 227 mm a Datacon 2200 evo bonder was used. ![]() A complete machine enclosure allows very demanding applications in a controlled environment.ĭepending on the requirements, the modular FINEPLACER® femto 2 can be individually configured and retrofitted at any time to support new applications and technologies. Chip assembly for larger panels of 510 mm x 515 mm size was carried out in an ASM SiPlace CA3. ESEC 2008XP Die Bonder Refurbished - CSI Semi Manual die Bonders Electron Mec. This makes the system a perfect tool and reliable companion as applications migrate from product development to production. #DATACON 2200 EVO REFURBISH MANUAL#Ģ002 > buy from CAE Datacon 2200 Evo Manual Sway ESEC / BESI 2008. 4), as the 5G evolution is driven by the growing mobile communication. EquipMatching is a marketplace for used, surplus and refurbished equipment. It covers the entire workflow of inspection, characterization, packaging, final test and qualification in semiconductor, communications, medical and sensor technologies. We consider graphene-integrated photonics for telecom and datacom systems as an. ![]()
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